Picosecond femtosecond laser cutting machine difference

Laser cutting machine is the use of high power density laser beam irradiation on the surface of the material, so that the material is heated to vaporize, evaporation to form holes, with the movement of the beam, the hole continuous formation of a very narrow width slit, so as to complete the cutting of the material.

With the upgrading speed of laser equipment is getting faster and faster, the laser industry at home and abroad is in a stage of rapid development, nanosecond, picosecond and femtosecond laser cutting machine has gradually become a hot market. Laser cutting machine is widely used in medical equipment, aerospace, electronic appliances, sheet metal processing, precision parts, automobile manufacturing and other manufacturing and processing industries.

First, we need to understand the concept of picoseconds and femtoseconds. 1 second =10^12 picoseconds =10^15 femtoseconds. Therefore, the common nanosecond, picosecond, femtosecond laser processing equipment on the market is named according to the time, referring to the time control unit in the laser processing process. Of course, there are various other factors such as monopulse energy, pulse width, pulse frequency and pulse peak power.

Under normal circumstances, laser cutting processing is a single pulse of energy in a very short time to the surface of the material, through high frequency of repetitive work to form drilling, cutting, slotting and other applications. According to the processing needs of different materials, choose picosecond or femtosecond laser processing equipment. The shorter the time, the shorter the time that the laser acts on the surface of the material, the smaller the impact on the surface of the material, and the better the processing effect. Different laser cutting machine applicable materials will also be different, such as picosecond laser cutting machine is often used for brittle material processing, femtosecond laser cutting machine is often used for conductive film oxide material processing and so on.

Laser drilling is one of the common applications, and the laser cutting machine completes the processing of the hole in the way of percussion drilling, and ensures the uniformity of the hole. In addition to circuit boards, laser cutting machines can also perform high-quality drilling on materials such as plastic films, semiconductors, metal films and sapphires. Coating removal is one of the micromachining applications of picosecond lasers, and picosecond laser cutters can precisely remove coatings without damaging or slightly damaging the base material. It can be a line a few microns wide, or it can be a few square centimeters of large area removal. Precision laser cutting is one of the common applications of femtosecond laser, femtosecond laser cutting machine can be used to cut a variety of substrate materials, or dig blind grooves and other fine processing.

As an excellent laser equipment manufacturer, men-luck provides various types of laser equipment, including all kinds of laser cutting machines, laser marking machines, laser welding machines. And provide high-quality system solutions to support sending samples and remote technical support.