Because ceramic materials have the advantages of high temperature resistance, high thermal conductivity, and high insulation, they are widely used in the semiconductor industry. Ceramic circuit boards are a very typical application. Common ceramic circuit boards mainly include alumina circuit boards and aluminum nitride circuit boards. As we all know, ceramics are a highly brittle and high-hardness material that requires high requirements for molding and processing processes, especially micro-hole processes. Traditional processing methods can easily cause ceramics to break. Laser micromachining just makes up for the shortcomings of traditional processes.
At present, ceramic circuit boards generally use lasers for laser cutting and drilling processes. Pulse laser is a kind of laser with high power density and good directionality. It is focused on the workpiece placed perpendicular to the laser through the optical system. The high-energy laser beam melts and vaporizes the material instantly, and a beam is coaxial with the beam. The air flow is ejected from the laser cutting head, blowing the molten material out from the bottom of the cutting opening to gradually form incisions or through holes. Circuit boards, electronic components, and semiconductor components are small in size and high in density. They have high requirements for the accuracy and speed of laser cutting and drilling. Generally, the diameter of micropores ranges from 0.05-0.2mm, which cannot be achieved with traditional processes. this precision.
With the continuous advancement of 5G construction, industrial fields such as precision microelectronics and aviation and shipbuilding have further developed, and these fields all cover the application of ceramic substrates. Among them, ceramic substrates have gradually been used more and more due to their superior performance. Ceramic substrates are the basic material for high-power electronic circuit structure technology and interconnection technology. They have a dense structure and a certain degree of brittleness. There are stresses in traditional processing methods, and very thin ceramic sheets can easily break. The non-contact cutting process of the laser cutting machine has no stress and can achieve flexible cutting of ceramic substrates.
Under the general trend of thinning, thinning and miniaturization, laser micromachining technology has replaced more and more traditional processes, playing an irreplaceable role in terms of quality, precision and efficiency. In the future, laser micromachining will develop in a more refined direction with market demand. As a professional ceramic circuit board laser cutting machine manufacturer, we will continue to develop higher quality laser cutting machine equipment to give back to new and old customers in the market.
Post time: Dec-01-2023