With the advancement of science and technology, traditional mechanical processing methods can no longer meet the needs for finer and more complex structures. Picosecond laser cutting machines have become an ideal choice with their unique advantages. This technology uses a picosecond laser beam that generates powerful energy in a very short time to achieve precise and non-contact cutting of various materials.
Picosecond laser cutting machines for thin film materials can be used for cutting PET films, PI films and other transparent materials. Picosecond laser cutting machines can directly process these materials, including laser cutting of PET films; they can also engrave conductive metals such as copper, aluminum, ITO, silver paste and FTO, and realize cutting, engraving and resistance adjustment functions of these materials; in addition, PI or other types of covering films attached to substrates such as glass and white appliances can be cut accurately without damaging the substrate.
As an important carrier of electronic components, circuit boards are widely used in various fields. With the upgrading of intelligent products, higher requirements are put forward for PCB sub-board processing, and laser cutting technology has begun to be introduced into the PCB industry. Picosecond laser cutting machines are mainly used for laser depaneling in the PCB industry. For example, FR4 boards, reinforced steel sheets, FPC flexible circuit boards, rigid-flex boards, and fiberglass boards can all be finely processed by picosecond lasers. Since there are usually very dense and tiny components and wire connection points on the circuit board, a high-precision processing method that does not cause damage or deformation is required. The use of picosecond laser cutting machines can comply with design requirements and ensure optimal performance.
Post time: Jul-10-2024