As we all know, operators, equipment manufacturers, device manufacturers and material manufacturers have built a pyramid shaped optical communication industry chain together. In the industry, the traditional optical communication device packaging technology generally uses UV glue to bond and fix the device at the junction surface. First, the UV glue is applied to the junction of the device, and then the UV lamp is used to irradiate and solidify the device. This device connection mode has many defects, such as limited curing depth; Laser welding, a new type of welding technology, has the advantages of firm welding, minimal deformation, high precision, fast speed and easy automatic control, which makes it one of the important means of optical communication device packaging technology. The following describes the technology of laser welding machine in the optical communication industry.
Optical devices and optical modules are located upstream of optical communication equipment. The main function of the optical module is to realize photoelectric conversion. Since the chip is the product with the greatest difficulty coefficient in the optical module industry chain, after the bare chip and wiring board achieve micro interconnection, it needs to be sealed in the plastic, glass, metal or ceramic shell through packaging technology to ensure that the semiconductor integrated circuit chip works normally under various adverse conditions. Laser welding is mainly used in this process.
As a high quality, high precision, high efficiency and high speed welding method, laser welding has been increasingly concerned and applied. Due to the high energy density of laser, laser welding is fast, deep and small in heat affected zone, which can realize automatic precision welding.
With the requirements of miniaturization, high-performance, multi-function and low-cost of electronic devices, laser welding technology, which has the advantages of firm welding, minimal deformation, high accuracy, fast speed and easy to realize automatic control, has become one of the important means of optical communication device packaging technology. Its application in the manufacturing process of optical communication optoelectronic devices, components and modules can effectively improve the welding accuracy and welding quality.
Post time: Dec-05-2022