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Advantages of picosecond UV laser cutting PI covering film

Advantages of picosecond UV laser cutting PI covering film

For a long time in the past, PI film cutting is mainly achieved by the traditional die-cutting method, which has the problem of low processing accuracy and high manufacturing cost, and with the development of electronic circuit design to miniaturization and high-density, the traditional die-cutting method has been increasingly unable to meet the design requirements. In order to meet the requirements of the PI film cutting industry for carbonization and efficiency, the application of high frequency, narrow pulse width picosecond UV laser cutting machine is more advantageous.

m-PI

Using picosecond ultraviolet laser cutting machine for PI coating film cutting, using non-contact processing, will not cause damage to the processed materials such as die-cutting method of stretching, deformation and other damage; Picosecond laser processing using small single pulse energy, high frequency processing, the effect is more fine; Strong adaptability, suitable for all kinds of material processing; The laser repetition rate is high, the galvanometer speed is fast, so the processing speed is also fast. And the laser’s focused spot can reach the micron level, which can realize the processing of high-density lines and microholes, which is an advantage to meet the development pace of circuit design, and is the ideal processing equipment for PI covered film cutting.

Men-luck is a laser equipment production enterprise, its products are laser cutting machine, laser marking machine, laser welding machine, can be customized according to customer needs, to provide professional system solutions and technical support, can send material proofing, welcome to have the demand of the enterprise contact us.


Post time: Jun-12-2024

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